Passive Cooling Analysis of an Electronic Chipset Using Nanoparticles and Metal-Foam Composite PCM: An Experimental Study

Thermal management of electronic components is critical for long-term reliability and continuous operation, as the over-heating equipment leads to decrement in performance. The novelty current experimental study investigate passive cooling equipment, by using nano-enriched phase change material (NEPCM) with copper foam having porosity 97%. PT-58 was used graphene nanoplatelets (GNPs) magnesium oxide (MgO) nanoparticles (NPs), concentrations 0.01 wt.% 0.02 wt.%. Three power levels 8 W, 16 24 corresponding heating inputs 0.77 kW/m2, 1.54 kW/m2 2.3 respectively, were simulate input heat sink thermal characterization. According results, at maximum base temperature declined 13.03% GNPs-NEPCM/copper case. At reduction 16% observed case 13.1% MgO-NEPCM/copper foam. Similarly, lessened 12.58% highest time reach set point 50 °C, 60 70 °C composites, while all gave comparable performance GNPs based composite. Similar trend enhancement ratio operation time. From it concluded that incorporation NEPCM an effective measure mitigate can provide best efficiency low higher loads.